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Advanced materials for thermal management of electronic packaging /
by
Tong, Xingcun Colin.
Publication:
New York : Springer, 2011 . xxi, 616 p. : 25 cm.
Date:
2011
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AUM Main Library (2),
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Advanced Materials for Thermal Management of Electronic Packaging
by
Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
Availability:
Copies available:
AUM Main Library (1),
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Tong, Xingcun Colin.
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